Revolutionizing audio: Qualcomm reveals S7 and S7 pro gen 1 sound platforms

Delhi : Qualcomm revealed its next-generation sound platforms, the Qualcomm S7 and S7 Pro Gen 1 at the Snapdragon Summit, Huwaii. The new sound platforms improve on the company's previous generation of sound platforms in various ways. The S7 and S7 Pro Gen 1 Sound Platforms are designed for earbuds, headphones, and speakers, and the firm claims that they are their most advanced audio platforms to date, with high-performance, low-power computation, on-device AI, and enhanced Connectivity.

The S7 Pro, the more expensive model, also adds micro-power Wi-Fi to extend the range of audio devices beyond the Bluetooth range, allowing customers to wander through their home, building, or even campus without losing the signal. According to the company, as they have also integrated the Snapdragon Sound Technology in their latest Snapdragon 8 Gen 3 Mobile Platform and Snapdragon X Elite, and when connected with a smartphone powered by the S7 or S7 Pro platforms, users will hear sound in a way that has not previously been conceivable.

"These platforms establish a new standard for high-performance audio at ultra-low power." "They are packed with premium technologies that work in tandem with on-device AI to deliver immersive and personalized audio experiences wherever you go - whether in a meeting, socializing, gaming, listening to music, or simply needing some quiet time," Dino Bekis, vice president and general manager, Wearables and Mixed Signals Solutions, Qualcomm Technologies, Inc. said.

Qualcomm S7 and S7 Pro Gen 1: Specifications

• New platform architecture for improved performance while consuming very little power.
• When compared to the Qualcomm S5 Gen 2 Sound Platform, the AI power is over 100 times greater.
• Memory is three times greater than that of the Qualcomm® S5 Gen 2 Sound Platform.
• DSP performance has been significantly improved, with a total audio compute capacity of 1.5 GHz, representing a 50%+ improvement over the prior S5 Gen 2 Sound Platform.
• Instead of employing the DSP, a dedicated AI core is used for enhanced speed and power efficiency in machine learning applications.
• Hearing loss compensation, ANC (Active Noise Cancellation), transparency, and noise management are all aspects of dedicated audio curation cores.
• Codec for high-quality stereo audio.
• 4th Generation Qualcomm Adaptive Active Noise Cancellation for responsive and customized audio curation with 112 biQuad filters and a fully configurable 3uSec low latency DSP.
• AuracastTM Broadcast Audio is supported by Bluetooth 5.4 radio and Bluetooth® LE experiences.
• 480 Mbps USB High-Speed PHY for improved audio development workflows.
• Low-level debugging with Qualcomm USB-EUD (Embedded USB Debug). Non-intrusive. Higher throughput and better memory and peripheral data sharing between subsystems, which reduces latency.
• Interfaces for digital audio, such as DMIC, I2S, TDM, and Soundwire.
• Fully integrated system with support for external supplies, a Power Management Unit (PMU), a charger, and microphone bias.
• Low power consumption and high-performance audio capabilities built for Snapdragon Sound.

1st Gen. Qualcomm S7 Pro Added characteristics:

• Support for micro-power Wi-Fi connectivity.
  
• Qualcomm XPAN technology provides coverage throughout the house and building.
  
• Seamless switching between Bluetooth and Wi-Fi.
  
• Provides up to 24-bit 192-kHz lossless audio streaming over Wi-Fi and supports data rates of up to 29 Mbps. It also supports Snapdragon Sound.